首页> 外国专利> EAR CHIP, EARPHONE, AND MANUFACTURING METHOD OF EAR CHIP

EAR CHIP, EARPHONE, AND MANUFACTURING METHOD OF EAR CHIP

机译:耳片,耳机以及耳片的制造方法

摘要

PROBLEM TO BE SOLVED: To provide an ear chip, an earphone, and a manufacturing method of the ear chip, in which both adhesion and mounting feeling are satisfied.;SOLUTION: The ear chip consists of: a cylindrical core part through which a front end part of an electroacoustic conversion element passes coaxially; a ring flange part which extends to a radiation direction from the core part; and a gel part, and is provided with a ring shape gel part which is arranged in a space between an outer surface of the core part and an inner circle surface of the flange part, and a gel deformation permission part which permits swelling deformation of the gel part arranged in the space, and the gel part contacts with at least a part of the inner circle surface of the flange part.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种兼具粘附性和安装感的耳片,耳机和耳片的制造方法。解决方案:耳片包括:圆柱形的芯部,前部穿过该芯部电声转换元件的端部同轴地通过。环形凸缘部从芯部向放射方向延伸。凝胶部,其特征在于,在芯部的外表面与凸缘部的内周面之间的空间配置有环状的凝胶部,以及允许凝胶膨胀膨胀的凝胶变形容许部。凝胶部分布置在空间中,并且凝胶部分与法兰部分的内圆表面的至少一部分接触。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011139180A

    专利类型

  • 公开/公告日2011-07-14

    原文格式PDF

  • 申请/专利权人 TAIKA:KK;

    申请/专利号JP20090296599

  • 发明设计人 TOYOSHIMA NAOKAZU;NAGATA SHINICHIRO;

    申请日2009-12-28

  • 分类号H04R1/10;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:25

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号