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METHOD FOR PULLING SINGLE CRYSTAL COMPOSED OF SILICON FROM MELT CONTAINED IN CRUCIBLE, AND SINGLE CRYSTAL PRODUCED THEREBY

机译:从含坩埚的熔体中拉制单晶硅的方法及其由此产生的单晶

摘要

PPROBLEM TO BE SOLVED: To further reduce the frequency of macroscopic voids in silicon single crystals without influencing the other crystal properties. PSOLUTION: In a method for pulling a silicon single crystal 9 from a melt 11 in a crucible 4, the single crystal 9 is surrounded by a heat shield 2 during pulling, the lower end 3 of the heat shield 2 is located at a predetermined distance h from the melt surface, and the flow 10 of a gas flows downward between the single crystal 9 and the heat shield 2, outward between the lower end 3 of the heat shield 2 and the melt 11, and then upward in the region outside the heat shield 2. The internal diameter DSBHS/SBof the heat shield 2 at its lower end 3 is larger by at least 55 mm than the diameter DSBSC/SBof the single crystal 9, and the radial width BSBHSU/SBof the heat shield 2 at its lower end 3 is not more than 20% of the diameter DSBSC/SBof the single crystal 9. PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:在不影响其他晶体特性的情况下,进一步降低单晶硅中宏观空隙的频率。

解决方案:在从坩埚4中的熔体11中拉出单晶硅9的方法中,在提拉过程中单晶9被隔热罩2包围,隔热罩2的下端3位于在距熔体表面预定距离h处,气体流10在单晶9和隔热罩2之间向下流动,在隔热罩2的下端3与熔体11之间向外流动,然后在熔池2中向上流动隔热屏2外部的区域。隔热屏2下端3的内径D HS 比隔热屏2的直径D SC 大至少55毫米。单晶9,并且隔热罩2在其下端3的径向宽度B HSU 不大于单晶9的直径D SC 的20%

COPYRIGHT:(C)2011,JPO&INPIT

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