HIGH STRENGTH LOW TEMPERATURE-FIRED CERAMIC AND METHOD FOR MANUFACTURING HIGH STRENGTH LOW TEMPERATURE-FIRED CERAMIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a high strength low temperature-fired ceramic which can be simultaneously fired with a low melting point metal and form a circuit board hardly causing crack or breakage, and a method for manufacturing the circuit board comprising the low temperature-fired ceramic.;SOLUTION: The high strength low temperature-fired ceramic contains at least Al, Si, Sr and Ba as essential ingredients and has at least one kind of hexagonal crystal SrAl₂Si₂O₈, (Sr, Ba)Al₂Si₂O₈ and BaAl₂Si₂O₈ and Al₂O₃ crystal in the structure.;COPYRIGHT: (C)2011,JPO&INPIT