EDGE GRIP DEVICE, TRANSFER ROBOT WITH THE SAME, AND METHOD OF RELEASING WAFER FOR SEMICONDUCTOR PROCESS

摘要

PROBLEM TO BE SOLVED: To provide an edge grip device capable of eliminating variations in positions of a wafer for a semiconductor process after a wafer for the semiconductor process is released.;SOLUTION: A chuck hand 1 includes a planar hand body 12 where a first receptacle 13 and a second receptacle 14 are opposed each other, and a pressing mechanism 17 in which a pressing surface 21a pushes an edge of a wafer 3 for a semiconductor process toward the first receptacle 13 for gripping along with the first receptacle 13. The second receptacle 14 has a step 16c at a second support surface 16. The step 16c is so formed as to hit the edge of the wafer 3 for a semiconductor process when the wafer 3 for semiconductor process that is gripped with the pressing mechanism is released and pushed back.;COPYRIGHT: (C)2011,JPO&INPIT