MECHANISM FOR ADJUSTING PLACEMENT LOAD OF HEAT SINK, AND THE HEAT SINK TO WHICH THE SAME IS APPLIED

摘要

PROBLEM TO BE SOLVED: To provide a new adjustment mechanism for diversely adjusting a placement load for fixing a heat sink on a circuit board even if the same spring member is used when placing the heat sink on the circuit board, and to provide a heat sink.;SOLUTION: The placement load adjustment mechanism 7 includes an amount-of-displacement control body 71 for adjusting the amount of displacement of a spring member 4 in a placed state at a body 2 of the heat sink, the spring member 4, or between them, thus adjusting a placement load when fixing the body 2 of the heat sink on the circuit board B. The amount-of-displacement control body 71 is formed at a position and in a shape for preventing blocking of formation of a radiation fin 22. The amount-of-displacement control body 71 is formed in one piece with a base unit 21 of the body 2 of the heat sink, and is cut to desired length according to a requested placement load in secondary processing after forming the body of the heat sink.;COPYRIGHT: (C)2011,JPO&INPIT