首页> 外国专利> MILLIMETER WAVE CIRCUIT MODULE AND MILLIMETER WAVE TRANSCEIVER EMPLOYING THE SAME

MILLIMETER WAVE CIRCUIT MODULE AND MILLIMETER WAVE TRANSCEIVER EMPLOYING THE SAME

机译:毫米波电路模块和毫米波收发器采用相同的电路

摘要

PROBLEM TO BE SOLVED: To obtain a mounting form suppressed in the characteristic deterioration of a flip-chip mounted semiconductor chip without using a radio wave absorber.;SOLUTION: Unwanted radiation in flip-chip mounting is reflected and generated by a characteristic impedance discontinuous portion of a transmission line. Its cause results form a structure having an intermittent shape of the transmission line, a parasitic capacitance pattern generated by an unnecessary conductor extending from a GND conductor equivalent to an open stab, and a GND pattern corresponding to a λ/2 wavelength of a millimeter wave signal. A line transformer is obtained where characteristic impedance is continuously changed from a microstrip line to a coplanar line for a conductor pattern using a taper or a curved line. A multilayer substrate is used for a circuit substrate. In the coplanar line, it is important to concentrate an electromagnetic wave component of the millimeter wave signal between gaps of the coplanar line. Therefore, a release pattern is formed at a grounding lower electrode, thereby suppressing unwanted radiation.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:在不使用无线电波吸收器的情况下,获得抑制倒装芯片安装的半导体芯片的特性劣化的安装形式。解决方案:倒装芯片安装中不需要的辐射被特征阻抗不连续部分反射并产生传输线。其原因结果形成具有传输线的断续形状的结构,由从相当于开路刺的GND导体延伸的不必要导体产生的寄生电容图案,以及与λ/ 2波长对应的GND图案的结果。波信号。获得一种线变压器,其中使用锥形或曲线将特征阻抗从微带线连续改变为导体图案的共面线。多层基板被用作电路基板。在共面线中,重要的是将毫米波信号的电磁波分量集中在共面线的间隙之间。因此,在接地的下部电极处形成了释放图案,从而抑制了不必要的辐射。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011172173A

    专利类型

  • 公开/公告日2011-09-01

    原文格式PDF

  • 申请/专利权人 HITACHI METALS LTD;

    申请/专利号JP20100036417

  • 发明设计人 NAGAISHI HIDEYUKI;SHIBAGAKI NOBUHIKO;

    申请日2010-02-22

  • 分类号H01P5/08;H01P5/02;H01P1/04;H01L23/12;

  • 国家 JP

  • 入库时间 2022-08-21 18:23:40

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