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Metal thin film layer of a conductive ITO film by the method and the method for forming a metal thin film layer to the conductive ITO film

机译:通过该方法以及将导电性ITO膜形成金属薄膜层的方法来形成导电性ITO膜的金属薄膜层

摘要

PROBLEM TO BE SOLVED: To provide a method, capable of forming a fine metal thin film pattern excellent in adherence properties on the surface of a conductive ITO film and a glass substrate of a base substrate, with high drawing precision, high workability, and high reproducibility.;SOLUTION: The thin film layer of transition metal is formed by applying a solvent formed by dissolving transition metal compound, containing organic anion and cation of transition metal in organic solvent on the ITO film and on the surface of the glass substrate of a base substrate, and applying heat treatment thereto. The fine metal thin-film pattern with superior adherence properties is formed on the surface of the transition metal thin film layer, by applying a liquid, in which metal fine particles with average size of 1 to 100 nm are dispersed at a prescribed thickness, and by forming a layer in which fine metal particles are sintered mutually, by heating and sintering the above.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种能够在导电性ITO膜和基底基板的玻璃基板的表面上形成附着性优异的微细金属薄膜图案的方法,该方法具有高的绘制精度,高的加工性和高的加工性。解决方案:过渡金属薄膜层是通过在ITO膜和玻璃基板表面上施加一种溶剂而形成的,该溶剂是通过将包含过渡金属化合物和过渡金属阳离子的过渡金属化合物溶解在有机溶剂中而形成的。基础基板,并对其进行热处理。通过施加液体,在过渡金属薄膜层的表面上形成液体,以规定的厚度分散平均粒径为1〜100nm的金属微粒,并在该过渡金属薄膜层的表面上形成附着性优异的金属薄膜图案。通过将上述物质加热并烧结而形成一层相互烧结的细金属颗粒。;版权所有:(C)2006,JPO&NCIPI

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