首页> 外国专利> STRUCTURE OF SCREED PLATE IN LEVELING DEVICE FOR RESIN PAVEMENT MATERIAL AND LEVELING METHOD FOR RESIN PAVEMENT MATERIAL USING THE SCREED PLATE

STRUCTURE OF SCREED PLATE IN LEVELING DEVICE FOR RESIN PAVEMENT MATERIAL AND LEVELING METHOD FOR RESIN PAVEMENT MATERIAL USING THE SCREED PLATE

机译:树脂铺面材料平整装置中筛板的结构和使用该筛板的树脂铺面材料平整方法

摘要

PROBLEM TO BE SOLVED: To provide a structure of a screed plate in a leveling device for a resin pavement material capable of improving leveling workability and finished state by the screed plate of the leveling device, and a leveling method for the resin pavement material using the screed plate.;SOLUTION: The vertical laid surface 1a and the horizontal laid surface 1b of the screed plate 1 are structured so as to be controlled to any temperature by a heat source means such as a heater or a high-frequency induction coil not shown. The surface temperature of the laid surface 1b is higher by 20-80°C than that of the laid surface 1a, and the temperature of the vertical laid surface 1a of the screed plate 1 is lower than that of the horizontal laid surface 1b at all times. Specifically, the surface temperature of the laid surface 1a is set to 20-30°C, and the surface temperature of the laid surface 1b is set to 50-100°C.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种用于树脂铺面材料的找平装置中的刮板的结构,该结构能够通过找平装置的刮板来改善找平可加工性和完成状态,以及使用该刮板的树脂铺面材料的找平方法解决方案:熨平板1的垂直放置表面1a和水平放置表面1b的结构使其可通过未示出的加热器或高频感应线圈等热源装置控制到任何温度。 。铺设面1b的表面温度比铺设面1a的表面温度高20〜80℃,并且整平板1的垂直铺设面1a的温度比水平铺设面1b的温度低。次。具体地,将被放置表面1a的表面温度设置为20-30℃,并且将被放置表面1b的表面温度设置为50-100℃。COPYRIGHT:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011021363A

    专利类型

  • 公开/公告日2011-02-03

    原文格式PDF

  • 申请/专利权人 YOKOHAMA RUBBER CO LTD:THE;

    申请/专利号JP20090166420

  • 发明设计人 KOKUSHO MASATO;KIDO TAKANORI;

    申请日2009-07-15

  • 分类号E01C19/48;

  • 国家 JP

  • 入库时间 2022-08-21 18:22:52

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