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A printed circuit board that is fabricated using the design method and design method of a signal line in the printed circuit board

机译:使用印刷电路板的设计方法和信号线的设计方法制造的印刷电路板

摘要

PROBLEM TO BE SOLVED: To set variations in characteristic impedance of a signal line, for example, within a range of 50 Ω±10% while making variations in width of the signal line manageable within a range of ±15%, in a signal line design method in a printed board having the signal line in which a high-frequency signal is transmitted.;SOLUTION: The printed circuit board has a micro strip line structure A9 composed of a core substrate 1 having a permittivity εr1 and a thickness t1, a power supply ground circuit 4 formed on one face side of the core substrate, an insulating layer 6 formed on the other face side of the core substrate while having a permittivity εr2 and a thickness t2, and the signal line formed on the insulating layer. When designing the signal line in this structure, a permittivity εr is set to a prescribed value by setting the compound permittivity εr between the core substrate and the insulating layer to εr={εr1×t1/(t1+t2)}+{εr2×t2/(t1+t2)}, and setting t1 and t2 to a prescribed ratio so that the signal line has a prescribed width w9.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:设置信号线的特性阻抗的变化,例如,在50Ω%至10%的范围内,同时使信号线的宽度变化可控制在+/- 15%的范围内,例如,一种具有在其中传输高频信号的信号线的印刷电路板中的信号线设计方法;解决方案:印刷电路板具有微带线结构A9,其由具有介电常数εr1的芯基板1和厚度t1,形成在核心基板的一个侧面上的电源接地电路4,形成在核心基板的另一个侧面上同时具有介电常数εr2和厚度t2的绝缘层6以及信号线形成在绝缘层上。当以这种结构设计信号线时,通过将核心基板和绝缘层之间的复合介电常数εr设置为εr= {εr1乘以t1 /(t1),将介电常数ε设置为规定值。 + t2)} + {εr2× t2 /(t1 + t2)},然后将t1和t2设置为规定的比例,以使信号线具有规定的宽度w9 。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP4723391B2

    专利类型

  • 公开/公告日2011-07-13

    原文格式PDF

  • 申请/专利权人 株式会社メイコー;

    申请/专利号JP20060023132

  • 发明设计人 大関 政広;

    申请日2006-01-31

  • 分类号H01P3/08;H05K3/00;H05K3/46;H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-21 18:22:17

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