Electronic component mounting position inspection method and electronic component mounting position inspection equipment

摘要

PROBLEM TO BE SOLVED: To provide a method of and device for inspecting an electronic component mounted position capable of efficiently and accurately inspecting the mounted position of an electronic component mounted on an electrode pad by thermo-compression bonding automatically without depending on the individual difference of an inspection person.;SOLUTION: First of all, an observation image of the electrode pad 3 through a transparent mounting substrate 1 by a differential interference microscope 8 is acquired as electronic image data. Then, a circumscribed line circumscribing an aggregate of light and darkness 11 generated by mounting the electronic component 2 is drawn relative to the acquired electronic image data. The center point of a quadrangle formed by the circumscribed line is determined in succession. The center point is used as a representative point C representing the aggregate of light and darkness 11. A position coordinate of the representative point C is determined by using a coordinate system using a prescribed design point R on the electrode pad 3 as the origin. The mounted position of the electronic component 2 to the electrode pad 3 is inspected from an observation image of the differential interference microscope 8.;COPYRIGHT: (C)2007,JPO&INPIT