Connecting device between electronic components due to heat generation temperature control of adhesive and connection method between electronic components due to heat generation temperature control of adhesive

摘要

Relates to connection between electronic components, more in particular, if the horn by (horn), vibration and pressure is applied to the adhesive for the connection between electronic components, the present invention, the strain to be generated in the adhesive ( relates to a connection device between electronic components for carrying out this method and a method for connecting electronic components between by adjusting the strain), and to easily adjust the self-heating temperature of the adhesive. [Selection Figure Figure 2