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In the convergence ion beam process manner which does convergence ion beam process manner and thin layer conversion processing

机译:在会聚离子束处理方式和薄层转换处理中的会聚离子束处理方式中

摘要

PROBLEM TO BE SOLVED: To provide an FIB processing method capable of removing a strain generated in a slicing course, and performing finish machining with a sliced part stably fixed.;SOLUTION: This FIB processing method for slicing a sample by FIB irradiation is characterized as follows: the sliced part is formed by the FIB irradiation; notching is performed by tilting a sample stand so as to remain a connection part on a part of the upper end on the side part of the sliced part; and then the sample stand is returned into the original attitude, and finish machining of the sliced part is performed by the FIB irradiation.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种FIB加工方法,该FIB加工方法能够消除在切片过程中产生的应变,并在切片部分稳定地进行精加工。解决方案:该FIB加工方法的特征在于通过FIB辐照将样品切片接着,通过FIB照射形成切片部分。通过使样品台倾斜以使连接部分保持在切片部分的侧部的上端的一部分上来进行切槽。然后将样品架返回到原始姿态,并通过FIB辐照对切片的零件进行精加工。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP4801432B2

    专利类型

  • 公开/公告日2011-10-26

    原文格式PDF

  • 申请/专利权人 株式会社半導体エネルギー研究所;

    申请/专利号JP20050356346

  • 发明设计人 溝口 隆文;

    申请日2005-12-09

  • 分类号G01N1/32;H01J37/20;G01N1/28;

  • 国家 JP

  • 入库时间 2022-08-21 18:21:30

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