ELECTROLESS COPPER-PLATING SOLUTION, ELECTROLESS COPPER-PLATING METHOD, AND METHOD FOR FORMING OF EMBEDDED WIRING

摘要

PROBLEM TO BE SOLVED: To provide an electroless copper-plating solution which can form an electroless copper-plated layer that is uniform even into the bottom of the hole regardless of the size of the inner diameter of the hole, an electroless copper-plating method, and a method for forming an embedded wiring, which can form reliable embedded wiring in the inner part of the hole by forming the electroless-copper-plated layer.;SOLUTION: The electroless copper-plating solution contains a polyethylene glycol compound having a thiol group or a disulfide bond, and copper ions. Further, the electroless copper-plating method is characterized in that a substrate 1 with a hole 2 formed is dipped into the electroless copper-plating solution to form an electroless-copper-plated layer 6 at the inside of the hole. Further, the method for forming of embedded wiring is characterized in the substrate 1 with the hole 2 formed is dipped into the electroless copper-plating solution to form embedded wiring made of the electroless-copper-plated layer 6 at the inside of the hole.;COPYRIGHT: (C)2011,JPO&INPIT