High-temperature storage reliability evaluation method of the thermosetting resin composition semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a technique for shortening evaluation time of high temperature storage reliability without raising treatment temperature.;SOLUTION: The method of evaluating high temperature storage reliability of a semiconductor device formed by bonding and fixing a semiconductor element 4 on a lead frame and a die pad of a BGA substrate and by sealing it with a resin 7 etc. after connecting a wire bonding pad of the semiconductor element to an inner lead 2 of the lead frame and a wire bonding pad of the BGA substrate using a gold wire 3, comprises: daisy-chaining the circuit, accumulating connection resistance between the semiconductor element and the gold wire, and outputting it.;COPYRIGHT: (C)2008,JPO&INPIT