Plating film connecting terminal member, a connection terminal with this, plating film material and the multilayer plating material used for this, as well as processes for the preparation of the plating film connecting terminal member

摘要

PROBLEM TO BE SOLVED: To provide a connecting terminal member capable of suppressing or preventing the occurrence of whisker while suppressing the quantity of a rare metal to be used and improving both of solderability (wettability) to lead-free solder and slidability.;SOLUTION: The connecting terminal member is formed by reflowing a multilayer plated material having a first plating layer comprising tin or a tin alloy on the outside of the conductive base material and a second plating layer comprising indium on the first plating layer. The thickness of the first plating layer in a connection/disconnection part of the connecting terminal member is controlled to 0.3-3 m, the thickness in the soldered part of the connecting terminal member is controlled to be thicker than that of the connection/disconnection part and the thickness of the second plating layer is controlled to 0.05-0.2 m.;COPYRIGHT: (C)2011,JPO&INPIT