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Plating member, plating terminal connector, a method of manufacturing a plated member, and a method of manufacturing a connector for plating terminal

机译:电镀部件,电镀端子连接器,电镀部件的制造方法以及电镀端子用连接器的制造方法

摘要

Provided are: a plated member and a plated terminal for a connector, each comprising a silver-tin alloy layer that covers the surface of a basis material and a silver cover layer that covers the surface of the silver-tin alloy layer and suffering from little peeling of the silver-tin alloy layer; and processes by which said plated member and said plated terminal for a connector can be produced in a short time. A plated member which comprises a silver-tin alloy layer that covers the surface of a basis material and a silver cover layer that covers the surface of the silver-tin alloy layer and in which the silver cover layer is exposed on the outermost surface, wherein the silver-tin alloy layer exhibits, over the whole thickness region, an area fraction of voids of 30% or less in any plane parallel to the surface of the basis material. A process for producing said plated member, comprising: laminating tin plating layers and silver plating layers formed using a selenium-containing plating solution alternately on the surface of a basis material to form a laminated product in which the outermost layer is a silver plating layer; and then heating the laminated product.
机译:提供:一种用于连接器的镀覆构件和镀覆端子,每个镀覆构件和镀覆端子均包括覆盖基础材料的表面的银锡合金层和覆盖银锡合金层的表面且几乎不遭受任何损害的银覆盖层。银锡合金层的剥离;以及可以在短时间内生产所述镀覆部件和所述连接器镀覆端子的方法。一种镀覆构件,其包括覆盖基础材料的表面的银-锡合金层和覆盖所述银-锡合金层的表面并且其中银覆盖层暴露在最外表面上的银覆盖层,其中银-锡合金层在整个厚度区域上,在平行于基础材料表面的任何平面上的空隙的面积分数均小于或等于30%。所述镀覆部件的制造方法,其特征在于,在基材的表面上交替层叠锡镀层和使用含硒镀液形成的银镀层,以形成最外层为银镀层的层叠体。然后加热层压产品。

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