Photo coupler and photo coupler array and photo coupler internal die semiconductor integrated circuit

摘要

PROBLEM TO BE SOLVED: To provide a novel photocoupler which can be fabricated in a semiconductor integrated circuit chip.;SOLUTION: The photocoupler 100 comprises a silicon substrate 101, a photodiode 107 provided thereon, a silicon oxide film 102, a polyimide film 103, a conductive film 116 and a polyimide film 115 provided on the silicon substrate 101, a transparent substrate 111 arranged on the polyimide film 115, and a surface light source 112 provided on the transparent substrate 111. The conductive film 116 constitutes an input pad 106, a movable mirror 104 and a hinge 105. The polyimide film 103 and the polyimide film 115 constitute a spacer and surrounds the movable mirror 104 and the photodiode 107. Furthermore, the photocoupler 100 has a reflective film 109 provided on the lower surface of the transparent substrate 111. The reflective film 109 has an opening 110 and the surface light source 112 faces the movable mirror 104 through the opening 110.;COPYRIGHT: (C)2005,JPO&NCIPI