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The polymer which features that the polymer of the monomer possessing acetylene Characteristic triple bond, the constituent for the film formation which uses this, directly

机译:直接具有乙炔特征的单体的聚合物具有特征性三键的聚合物,使用其的成膜成分直接

摘要

PROBLEM TO BE SOLVED: To provide a polymer having good film properties such as permittivity and mechanical strength, the polymer being used for electronic devices and the like, and to provide a film-forming composition containing the polymer, an insulating film obtained by using the film-forming composition, and an electronic device having the insulating film.;SOLUTION: The polymer is obtained by polymerizing a monomer containing substituents (A) and (B) in a molecule, wherein the substituent (A) represents one -C≡CH, and the substituent (B) represents one or more -C≡C-R, wherein R represents a substituent other than a hydrogen atom. The film-forming composition is prepared by using the polymer. The insulating film is obtained by using the film-forming composition, The electronic device has the insulating film.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:为了提供具有良好的诸如介电常数和机械强度的膜性质的聚合物,该聚合物被用于电子器件等,并且提供一种包含该聚合物的成膜组合物,该绝缘膜是通过使用膜;和具有绝缘膜的电子器件。;解决方案:该聚合物是通过将分子中包含取代基(A)和(B)的单体聚合而成的,其中取代基(A)代表一个-C&CH ,并且取代基(B)代表一个或多个-C&CR,其中R代表氢原子以外的取代基。通过使用聚合物制备成膜组合物。通过使用成膜组合物获得绝缘膜,电子设备具有绝缘膜。; COPYRIGHT:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP4734055B2

    专利类型

  • 公开/公告日2011-07-27

    原文格式PDF

  • 申请/专利权人 富士フイルム株式会社;

    申请/专利号JP20050212877

  • 发明设计人 渡辺 克之;

    申请日2005-07-22

  • 分类号C08F38/00;H01L21/312;

  • 国家 JP

  • 入库时间 2022-08-21 18:20:09

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