首页> 外国专利> Earthquake damage diffusion reduction method and earthquake damage diffusion reduction system in semiconductor manufacturing equipment

Earthquake damage diffusion reduction method and earthquake damage diffusion reduction system in semiconductor manufacturing equipment

机译:半导体制造设备中的地震破坏扩散减小方法和地震破坏扩散减小系统

摘要

A method and a system of reducing spreading earthquake damages in a semiconductor manufacturing apparatus are provided to prepare for earthquake damage by sensing a preliminary tremor directly. In a method and a system of reducing spreading earthquake damages, a receiver(28) receives urgency earthquake information based on preliminary tremors allotted through a communications line(26). The preliminary tremor directly is detected by a preliminary tremors detection unit, and a controller(29) stops a manufacturing apparatus for a semiconductor(1) based on the received urgency earthquake information and the detected preliminary tremor.
机译:提供一种减少半导体制造设备中的扩展地震破坏的方法和系统,以通过直接感测初步地震来准备地震破坏。在减少扩展地震破坏的方法和系统中,接收器(28)基于通过通信线路(26)分配的初步地震来接收紧急地震信息。初步震颤由初步震颤检测单元直接检测,并且控制器(29)基于接收到的紧急地震信息和检测到的初步震颤来停止半导体(1)的制造设备。

著录项

  • 公开/公告号JP4778546B2

    专利类型

  • 公开/公告日2011-09-21

    原文格式PDF

  • 申请/专利权人 東京エレクトロン株式会社;

    申请/专利号JP20080270753

  • 发明设计人 菅原 佑道;菊池 浩;

    申请日2008-10-21

  • 分类号H01L21/677;

  • 国家 JP

  • 入库时间 2022-08-21 18:20:03

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号