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Sputtering target consisting of manufacturing novel design, a method of manufacturing the same, and methods of use thereof
Sputtering target consisting of manufacturing novel design, a method of manufacturing the same, and methods of use thereof
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机译:由制造新颖的设计构成的溅射靶,其制造方法及其使用方法
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摘要
A sputtering target is described herein, which includes: a) a surface material, and b) a core material coupled to the surface material, wherein at least one of the surface material or the core material has less than 100 ppm defect volume. Methods for producing sputtering targets are described that include: a) providing at least one sputtering target material, b) melting the at least one sputtering target material to provide a molten material, c) degassing the molten material, d) pouring the molten material into a target mold. In some embodiments, pouring the molten material into a target mold comprises under-pouring or under-skimming the molten material from the crucible into the target mold. Sputtering targets and related apparatus formed by and utilizing these methods are also described herein. In addition, uses of these sputtering targets are described herein.
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