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Sputtering target consisting of manufacturing novel design, a method of manufacturing the same, and methods of use thereof

机译:由制造新颖的设计构成的溅射靶,其制造方法及其使用方法

摘要

A sputtering target is described herein, which includes: a) a surface material, and b) a core material coupled to the surface material, wherein at least one of the surface material or the core material has less than 100 ppm defect volume. Methods for producing sputtering targets are described that include: a) providing at least one sputtering target material, b) melting the at least one sputtering target material to provide a molten material, c) degassing the molten material, d) pouring the molten material into a target mold. In some embodiments, pouring the molten material into a target mold comprises under-pouring or under-skimming the molten material from the crucible into the target mold. Sputtering targets and related apparatus formed by and utilizing these methods are also described herein. In addition, uses of these sputtering targets are described herein.
机译:本文描述了一种溅射靶,其包括:a)表面材料,和b)耦合至该表面材料的芯材料,其中所述表面材料或芯材料中的至少一种具有小于100ppm的缺陷体积。描述了用于制造溅射靶的方法,该方法包括:a)提供至少一种溅射靶材料,b)熔化至少一种溅射靶材料以提供熔融材料,c)对熔融材料进行脱气,d)将熔融材料倒入目标模具。在一些实施例中,将熔融材料倒入目标模具中包括将熔融材料从坩埚倒入或撇渣到目标模具中。本文还描述了通过和利用这些方法形成的溅射靶和相关设备。另外,本文描述了这些溅射靶的用途。

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