首页> 外国专利> The process which prepares the substrate of production mannered null A. 1st conduction die of the semiconductor power device which has the voltage maintenance formation which possesses

The process which prepares the substrate of production mannered null A. 1st conduction die of the semiconductor power device which has the voltage maintenance formation which possesses

机译:具有生产习惯的空A的基板的制备方法。具有保持电压的结构的半导体功率器件的第一导电模具有

摘要

A method is provided for forming a power semiconductor device. The method begins by providing a substrate of a first conductivity type and then forming a voltage sustaining region on the substrate. The voltage sustaining region is formed by depositing an epitaxial layer of a first conductivity type on the substrate and forming at least one terraced trench in the epitaxial layer. The terraced trench has a plurality of portions that differ in width to define at least one annular ledge therebetween. A barrier material is deposited along the walls of the trench. A dopant of a second conductivity type is implanted through the barrier material lining the annular ledge and said trench bottom and into adjacent portions of the epitaxial layer. The dopant is diffused to form at least one annular doped region in the epitaxial layer and at least one other region located below the annular doped region. A filler material is deposited in the terraced trench to substantially fill the trench, thus completing the voltage sustaining region. At least one region of the second conductivity type is formed over the voltage sustaining region to define a junction therebetween.
机译:提供了一种用于形成功率半导体器件的方法。该方法开始于提供第一导电类型的基板,然后在基板上形成电压维持区。通过在衬底上沉积第一导电类型的外延层并在该外延层中形成至少一个梯形沟槽来形成电压维持区。阶梯状沟槽具有多个宽度不同的部分,以在它们之间限定至少一个环形壁架。阻挡材料沿着沟槽的壁沉积。第二导电类型的掺杂剂通过衬里环形壁架和所述沟槽底部的阻挡层材料注入到外延层的相邻部分中。掺杂剂被扩散以在外延层中形成至少一个环形掺杂区域以及在环形掺杂区域下方形成至少一个其他区域。填充材料沉积在阶梯状沟槽中以基本上填充沟槽,从而完成电压维持区域。在电压维持区域上方形成第二导电类型的至少一个区域,以在它们之间限定结。

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