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Scribing method of brittle material substrate and scribing wheel
Scribing method of brittle material substrate and scribing wheel
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机译:脆性材料基材的划刻方法及划刻轮
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摘要
It is also possible to produce a deep vertical crack if necessary wear of the cutting edge and also a long life less, even if the scribe relatively hard substrate of the ceramic substrate or the like, wear of the cutting edge is small, and the vertical crack having a predetermined depth I will provide a scribing wheel to cause. Outer diameter to form the grooves 13 at predetermined intervals in the range of wheel 1mm~5mm, the cutting edge 12 of the ridge. Then, the above 25μm depth D of the groove 13, and 25μm or more of the length L of the ridge 14 between the grooves. The pitch P of the groove 13, the range of 50μm~200μm is preferred.
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