The process which forms the slot which becomes segmentation start place in order to segment the particular laser component

摘要

PPROBLEM TO BE SOLVED: To suppress generation of stress inside a laser element occurring when bonding the laser element to a submount and cooling to room temperature, and generation of warpage of the laser element and the submount. PSOLUTION: A method includes a step of forming segmentalization starting parts C1 and C2 which become segmentalization starting positions for segmentalizing a laser element 25 into a plurality of laser unit elements 15 to the laser element 25 having a plurality of light emitting parts, a step of joining the laser element 25 on which the segmentalization starting parts C1 and C2 are formed on a submount 30, and a step of segmentalizing the laser element 25 jointed on the submount 30 into the laser unit elements 15. The step of forming the segmentalization starting parts C1 and C2 has at least two segmentalization starting parts C1 and C2 along an arrangement direction of the light emitting parts between the laser unit elements 15 adjacent to each other. PCOPYRIGHT: (C)2009,JPO&INPIT