Metal base circuit board and its manufacturing method as well as hybrid integrated circuit using the same

摘要

A metal base circuit board capable of being not only installed to a flat portion but closely attached to a side surface or a bottom surface of a case or to a curved surface, and being excellent in heat dissipation capacity, electric insulation capacity and flexibility and a production method thereof, and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source unit using it. A metal base circuit board which is a circuit board comprising insulating layers and conductive circuits or metal foils that are laminated alternately, characterized in that the thickness of the conductive circuit or a metal foil is 5[mu]m through 450[mu]m, the insulating layer consists of a hardening material of a resin composition containing inorganic filler and thermosetting resin, and the thickness of the insulating layer is 9[mu]m through 300[mu]m; and a hybrid integrated circuit using it. Or, a metal base circuit board comprising a layer having a coverlay and magnetic loss ora layer having dielectric loss. Further, a metal base circuit board comprising at least one light emitting diode (LED) mounted on the above conductive circuit.