Manufacturing method and a manufacturing method of a hybrid integrated circuit modules of insulated metal base circuit board

摘要

PROBLEM TO BE SOLVED: To provide an insulated metal base circuit board for reducing a warpage behavior generated by a thermal load in the packaging process of a substrate, and to provide a hybrid integrated circuit module using the circuit board.;SOLUTION: The insulated metal base circuit board takes a maximum rectangular shape possible in the insulated metal base circuit board where the variation ratio of the circuit occupancy rate of a conductor is not smaller than 0.3 and not larger than 3.0 on a circuit board sectional circuit surface vertical to the rectangular shape. The hybrid integrated circuit module uses the circuit board.;COPYRIGHT: (C)2010,JPO&INPIT