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The production mannered null copper quantity of the plating copper Al2O3 compound powder sintering body and

机译:电镀铜Al2O3复合粉末烧结体的生产习惯零铜量及

摘要

PROBLEM TO BE SOLVED: To provide a copper plated Al2O3 composite powder with which a sintered compact having excellent heat radiability and high density can be produced, to provide a method for producing the composite metal powder, to provide a copper plated Al2O3 composite powder sintered compact which has excellent heat radiability and high density, and to provide a method for producing the sintered compact.;SOLUTION: The copper plated Al2O3 composite powder is provided with a copper covered layer in which the content of copper is ≥60wt.% In the method for producing the copper plated Al2O3 composite powder, Al2O3 powder is preliminary subjected to pretreatment of imparting a catalyst by imidazolesilane and palladium chloride, thereafter, 1 to 10 wt.% copper is applied thereto by electroless plating, and next, copper is applied thereto by substitution plating.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供镀铜的Al 2 O 3 复合粉末,利用该粉末可制造出具有优异的散热性和高密度的烧结体,从而提供一种方法用于制备复合金属粉末,提供具有优良的散热性和高密度的镀铜的Al 2 O 3 复合粉末烧结体,并提供一种制备方法溶液:镀铜的Al 2 O 3 复合粉末具有覆铜层,其中铜的含量为In的60%(重量)初步制备了镀铜的Al 2 O 3 复合粉末的方法,即Al 2 O 3 粉末在通过咪唑硅烷和氯化钯进行赋予催化剂的预处理之前,其后,通过化学镀将1至10 wt%的铜施于其上,然后,通过置换镀将铜施于其上。 )2008,日本特许厅

著录项

  • 公开/公告号JP4598033B2

    专利类型

  • 公开/公告日2010-12-15

    原文格式PDF

  • 申请/专利权人 JX日鉱日石金属株式会社;

    申请/专利号JP20070200308

  • 发明设计人 増田 誠治;成澤 靖;

    申请日2007-08-01

  • 分类号C22C1/05;B22F1/02;C22C1/10;C22C9/00;C22C32/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:17:58

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