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The production mannered null copper quantity of the plating copper Al2O3 compound powder sintering body and
The production mannered null copper quantity of the plating copper Al2O3 compound powder sintering body and
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机译:电镀铜Al2O3复合粉末烧结体的生产习惯零铜量及
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摘要
PROBLEM TO BE SOLVED: To provide a copper plated Al2O3 composite powder with which a sintered compact having excellent heat radiability and high density can be produced, to provide a method for producing the composite metal powder, to provide a copper plated Al2O3 composite powder sintered compact which has excellent heat radiability and high density, and to provide a method for producing the sintered compact.;SOLUTION: The copper plated Al2O3 composite powder is provided with a copper covered layer in which the content of copper is ≥60wt.% In the method for producing the copper plated Al2O3 composite powder, Al2O3 powder is preliminary subjected to pretreatment of imparting a catalyst by imidazolesilane and palladium chloride, thereafter, 1 to 10 wt.% copper is applied thereto by electroless plating, and next, copper is applied thereto by substitution plating.;COPYRIGHT: (C)2008,JPO&INPIT
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机译:解决的问题:提供镀铜的Al 2 Sub> O 3 Sub>复合粉末,利用该粉末可制造出具有优异的散热性和高密度的烧结体,从而提供一种方法用于制备复合金属粉末,提供具有优良的散热性和高密度的镀铜的Al 2 Sub> O 3 Sub>复合粉末烧结体,并提供一种制备方法溶液:镀铜的Al 2 Sub> O 3 Sub>复合粉末具有覆铜层,其中铜的含量为In的60%(重量)初步制备了镀铜的Al 2 Sub> O 3 Sub>复合粉末的方法,即Al 2 Sub> O 3 Sub>粉末在通过咪唑硅烷和氯化钯进行赋予催化剂的预处理之前,其后,通过化学镀将1至10 wt%的铜施于其上,然后,通过置换镀将铜施于其上。 )2008,日本特许厅
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