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Processing method of a semiconductor surface using the same and semiconductor surface for treatment composition
Processing method of a semiconductor surface using the same and semiconductor surface for treatment composition
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机译:使用该表面的半导体表面的处理方法以及用于处理组合物的半导体表面
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摘要
Processing method of a semiconductor surface using the same and a semiconductor surface for a treatment composition can be easily removed at a low temperature in a short time, an anti-reflection coating layer in the manufacturing process of semiconductor devices or the like, further, anti-reflection coating layer The processing method of a semiconductor surface using the same and a semiconductor surface for treatment composition and not only enables the separation of the two layers of the resist layer, also allows separation of the cured resist layer produced during the etching process The object of the present invention is to provide, contains a compound generating a fluoride ion in water, and water and a carbon radical generating agent, if desired, the present invention is a semiconductor surface for treatment, characterized in that it contains an organic solvent further The invention relates to a method of treating a semiconductor surface, which comprises using the composition and composition.
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