Production method of production method, and flexible printed wiring board and flexible printed wiring board of layered product and layered product

摘要

As for topic of this invention, there are times when adhesion and moisture absorption solder heat resistance of the resin material and plated layer are improved in the flexible printed wiring board which can making use of the layered product and that. A) at least, the high-molecular film/it administers plating to the resin material which consists of the plated cambium which at least contains the crystal characteristic thermoplastic resin at least, the high-molecular film/plated process and B which produce the layered product which consists of plated cambium/the plated layer which at least contains the crystal characteristic thermoplastic resin) the heating process which administers heating to the aforementioned layered product, it features that it includes, it can solve the above-mentioned topic at least, the high-molecular film/with the production method of the layered product which consists of plated cambium/the plated layer which at least contains the crystal characteristic thermoplastic resin.