The ink constituent for organicity semiconductor device light-shielding film formation, light-shielding film formation manner and the organicity transistor component which possesses the light-shielding film

摘要

There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200°C or less and a liquid resin that is in a liquid state at 10 to 50°C at a ratio (solid resin/liquid resin) of 0.2 to 0.6.