PHOTOELECTRIC CONVERSION FILM-STACKED SOLID-STATE IMAGING DEVICE WITHOUT MICROLENSES, ITS MANUFACTURING METHOD, AND IMAGING APPARATUS

摘要

There are provided a circuit board; a semiconductor substrate bonded to a light-incidence-side surface of the circuit board; a photoelectric conversion film stacked on a layer that is disposed on the light incidence side of the semiconductor substrate; an imaging device chip having signal reading means which is formed in a surface portion of the semiconductor substrate, for reading out, as shot image signals, signals corresponding to signal charge amounts detected by the photoelectric conversion film according to incident light quantities; a transparent substrate bonded to a layer that is disposed on the light incidence side of the photoelectric conversion film with a transparent resin adhesive; and bonding wires which connect connection pads formed on a peripheral portion, not covered with the transparent substrate, of the semiconductor substrate to connection terminals on the circuit board.