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Photoelectric conversion film-stacked solid-state imaging device without microlenses, its manufacturing method, and imaging apparatus
Photoelectric conversion film-stacked solid-state imaging device without microlenses, its manufacturing method, and imaging apparatus
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机译:无微透镜的光电转换膜堆叠式固态成像装置,其制造方法和成像装置
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摘要
There are provided a semiconductor substrate; a photoelectric conversion film stacked on a layer that is disposed on the light incidence side of the semiconductor substrate; signal reading unit formed in a surface portion of the semiconductor substrate, for reading out, as shot image signals, signals corresponding to signal charge amounts detected by the photoelectric conversion film according to incident light quantities; a transparent substrate bonded to a layer that is disposed on the light incidence side of the photoelectric conversion film with a transparent resin as an adhesive; and electric connection terminals which are connected to the signal reading unit by interconnections and which penetrate through the semiconductor substrate and are exposed in a surface, located on the opposite side to the side where the photoelectric conversion film is provided, of the semiconductor substrate.
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