HIGH-SPEED WIRELESS SERIAL COMMUNICATION LINK FOR A STACKED DEVICE CONFIGURATION USING NEAR FIELD COUPLING

摘要

A memory module houses stacked memory devices and a memory controller each having a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on a memory device substrate or molded into a plastic mold to create near-field magnetic coupling with the stacked memory devices and the memory controller.