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HIGH-SPEED WIRELESS SERIAL COMMUNICATION LINK FOR A STACKED DEVICE CONFIGURATION USING NEAR FIELD COUPLING
HIGH-SPEED WIRELESS SERIAL COMMUNICATION LINK FOR A STACKED DEVICE CONFIGURATION USING NEAR FIELD COUPLING
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机译:利用近场耦合实现堆叠设备配置的高速无线串行通信链路
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摘要
In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.
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