首页> 外国专利> FAULT DETECTION AND CLASSIFICATION METHOD FOR WAFER ACCEPTANCE TEST PARAMETERS

FAULT DETECTION AND CLASSIFICATION METHOD FOR WAFER ACCEPTANCE TEST PARAMETERS

机译:晶圆合格测试参数的故障检测与分类方法

摘要

A fault detection and classification (FDC) method for wafer acceptance test (WAT) parameters includes the following steps. A plurality of fault detection and classification parameters is collected. A plurality of wafer acceptance test parameters that are corresponded by the fault detection and classification parameters is collected. The fault detection and classification parameters are grouped. A contingency table of the wafer acceptance test parameters corresponding to the fault detection and classification parameters is built. A probability model of the contingency table is built. Finally, a safety range of the probability model is determined.
机译:晶圆验收测试(WAT)参数的故障检测和分类(FDC)方法包括以下步骤。收集多个故障检测和分类参数。收集与故障检测和分类参数相对应的多个晶片验收测试参数。故障检测和分类参数被分组。建立对应于故障检测和分类参数的晶片接受测试参数的列联表。建立了列联表的概率模型。最后,确定概率模型的安全范围。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号