PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULANT MATERIAL TO RESIST OUT-OF-PLANE DEFORMATION

摘要

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.