ENCAPSULANT INCLUDING A SPHERE WITH DIFFERENT HARDNESS AND AN LED PACKAGE USING THE SAME CAPABLE OF PREVENTING A CRACK DUE TO THE THERMAL DEFORMATION OF THE ENCAPSULANT

摘要

PURPOSE: An encapsulant including spheres with different hardness and an LED package using the same are provided to obtain a high hardness and a low thermal expansibility by mixing a solid sphere with a liquid encapsulant.;CONSTITUTION: A lead frame(120) is installed on a substrate(110). An LED chip(130) is installed in a lead frame and emits light. A bonding wire(140) electrically connects the LED chip to the lead frame. A reflector(150) reflects light emitted from the LED chip. An encapsulant(200) is filled with the reflector and seals the LED chip and the bonding wire.;COPYRIGHT KIPO 2013