ELECTROPLATING ADDITIVE FOR THE DEPOSITION OF METAL, A BINARY, TERNARY, QUATERNARY OR PENTANARY ALLOY OF ELEMENTS OF GROUP 11 (IB)-GROUP 13 (IIIA)-GROUP 16 (VIA)

摘要

The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives have the general formula (A):; ;wherein X₁ and X₂ may be the same or different and are selected from the group consisting of arylene and heteroarylene; FG₁ and FG₂ may be the same or different or are selected from the group consisting of —S(O)₂OH, —S(O)OH, —COOH, —P(O)₂OH and primary, secondary and tertiary amino groups and salts and esters thereof; R is selected from the group consisting of alkylene, arylene or heteroarylene and n and m are integers from 1 to 5.