首页> 外国专利> METHOD FOR CONNECTION OF FLEXIBLE CIRCUIT BOARDS TO RIGID CIRCUIT BOARD, DEVICE FOR CONNECTION THEREOF, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS

METHOD FOR CONNECTION OF FLEXIBLE CIRCUIT BOARDS TO RIGID CIRCUIT BOARD, DEVICE FOR CONNECTION THEREOF, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS

机译:用于将柔性电路板连接至刚性电路板的方法,用于其的连接装置,印刷电路板组件以及电子设备

摘要

A method for connection of a flexible circuit board to a rigid circuit board is provided. The method includes supplying an adhesive agent onto a first electrode pattern provided on one surface of the rigid circuit board. The rigid circuit board has a plurality of electronic components mounted on the other surface with a gap therebetween. The method also includes aligning a second electrode pattern provided on the flexible circuit board to the first electrode pattern of the rigid circuit board. The adhesive agent is heated under pressure to electrically connect the second electrode pattern to the first electrode pattern by pressing the gap between the plurality of electronic components with a jig which has a press-contact section of a narrower width than the gap.
机译:提供一种用于将柔性电路板连接到刚性电路板的方法。该方法包括将粘合剂供应到设置在刚性电路板的一个表面上的第一电极图案上。刚性电路板具有安装在另一表面上且其间具有间隙的多个电子部件。该方法还包括将设置在柔性电路板上的第二电极图案与刚性电路板的第一电极图案对准。在压力下加热粘合剂,以通过具有压接部的宽度比该间隙窄的夹具按压多个电子部件之间的间隙来将第二电极图案电连接至第一电极图案。

著录项

  • 公开/公告号US2011188214A1

    专利类型

  • 公开/公告日2011-08-04

    原文格式PDF

  • 申请/专利权人 KINUKO MISHIRO;

    申请/专利号US201113012861

  • 发明设计人 KINUKO MISHIRO;

    申请日2011-01-25

  • 分类号H05K1/02;H05K3/36;

  • 国家 US

  • 入库时间 2022-08-21 18:12:49

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