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Method and System for Communication Capacity Negotiation of Physical Layer Chips

机译:物理层芯片通信能力协商的方法和系统

摘要

A method for communication capacity negotiation for physical layer chips performed by a network device provided with a first physical layer chip and a second physical layer chip includes, with the first physical layer chip, negotiating communication capacity with an opposite end, and reporting the communication capacity confirmed by negotiation to the second physical layer chip; and with the second physical layer chip, adopting the communication capacity acquired from the first physical layer chip to negotiate communication capacity with another opposite end by a fixed negotiation mode. A system for communication capacity negotiation of physical layer chips includes a first physical layer chip; and a second physical layer chip. The first physical layer chip negotiates a communication capacity with an opposite end, and reports the communication capacity confirmed by negotiation to the second physical layer chip; and the second physical layer chip adopts the communication capacity acquired from the first physical layer chip to negotiate communication capacity with another opposite end by a fixed negotiation mode.
机译:由具有第一物理层芯片和第二物理层芯片的网络设备执行的用于物理层芯片的通信容量协商的方法,包括与第一物理层芯片协商相对端的通信容量,并报告通信容量与第二物理层芯片协商确认;第二物理层芯片,采用从第一物理层芯片获取的通信容量,以固定的协商方式与另一端协商通信容量。一种物理层芯片的通信能力协商系统,包括:第一物理层芯片;第二物理层芯片。第一物理层芯片与对方协商通信容量,并将协商确定的通信容量上报给第二物理层芯片;第二物理层芯片采用从第一物理层芯片获取的通信容量,以固定的协商方式与另一端协商通信容量。

著录项

  • 公开/公告号US2011188519A1

    专利类型

  • 公开/公告日2011-08-04

    原文格式PDF

  • 申请/专利权人 YANG YU;

    申请/专利号US200913119888

  • 发明设计人 YANG YU;

    申请日2009-09-08

  • 分类号H04J3/22;

  • 国家 US

  • 入库时间 2022-08-21 18:12:47

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