首页> 外国专利> Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program

Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program

机译:基板处理系统,基板处理方法,密闭容器收纳装置,用于实施该基板处理方法的程序以及存储该程序的存储介质

摘要

A substrate processing system which is capable of preventing dust from becoming attached to substrates without increasing the degree of cleanliness of a clean room to a predetermined level, and also capable of increasing the substrate processing throughput without increasing the burden on workers. a plasma processing apparatus 2 that subjects semiconductor wafers W to plasma processing in a cleaned atmosphere. A SMIF 4 has a enclosure 23 that is connected to the plasma processing apparatus 2 and has a cleaned atmosphere therein, a pod stage 26 on which a pod 3 housing semiconductor wafers W is mounted, a pod mounting portion 24 that carries out removal of semiconductor wafers W from the pod 3 and housing of semiconductor wafers W into the pod 3, and a wafer cassette transfer arm 27 that transfers semiconductor wafers W between the pod stage 26 and the plasma processing apparatus 2 via the enclosure 23. A preliminary loader 5 having a stage-shaped unprocessed pod port 28 that stores a pod 3 housing semiconductor wafers W that have not been subjected to the plasma processing, a shelf-like processed pod port 29 that stores a sealed container housing semiconductor wafers W that have been subjected to the plasma processing, and a pod moving mechanism 30 that moves the pods 3 between the stage-shaped unprocessed pod port 28 and the pod stage 26, and between the pod stage 26 and the shelf-like processed pod port 29.
机译:能够在不将洁净室的清洁度提高到预定水平的情况下防止灰尘附着到基板上的基板处理系统,并且能够在不增加工人负担的情况下增加基板处理量。等离子体处理装置 2 ,其在清洁的气氛中对半导体晶片W进行等离子体处理。 SMIF 4 具有与等离子体处理设备 2 连接并具有清洁气氛的外壳 23 ,吊舱台在安装有容纳半导体晶片W的容器 3 的图26 中,用于从容器去除半导体晶片W的容器安装部 24 。 3 并将半导体晶片W容纳到容器 3 中,以及晶片盒转移臂 27 ,其在容器台 26之间转移半导体晶片W 和等离子处理设备 2 通过外壳 23 。初步装载器 5 具有阶段形状的未处理的容器端口 28 ,其存储容器 3 ,该容器容纳未经过处理的半导体晶片W。等离子体处理,收纳了进行了等离子体处理的半导体晶片W的密闭容器的架子状的处理后的容器口 29 ,以及用于移动的容器 30 在未加工的吊舱端口 28 和吊舱平台 26 之间以及吊舱平台 26 <之间移动吊舱 3 / B>和经过架子处理的吊舱端口 29。

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