首页> 外国专利> Structural modification using electron beam activated chemical etch

Structural modification using electron beam activated chemical etch

机译:使用电子束激活的化学蚀刻进行结构修改

摘要

Structural modification using electron beam activated chemical etch (EBACE) is disclosed. A target or portion thereof may be exposed to a gas composition of a type that etches the target when the gas composition and/or target are exposed to an electron beam. By directing an electron beam toward the target in the vicinity of the gas composition, an interaction between the electron beam and the gas composition etches a portion of the target exposed to both the gas composition and the electron beam. Structural modifications of the target may be conducted by means of etching due to interaction between the electron beam and gas composition.
机译:公开了使用电子束激活化学蚀刻(EBACE)的结构修改。当气体成分和/或靶材暴露于电子束时,靶材或其一部分可暴露于对靶材进行刻蚀的气体成分。通过将电子束引导到气体成分附近的目标,电子束与气体成分之间的相互作用蚀刻了暴露于气体成分和电子束两者的靶的一部分。由于电子束和气体成分之间的相互作用,可以通过蚀刻进行靶的结构改性。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号