首页> 外国专利> Laser processing apparatus, laser processing method, manufacturing method of wiring substrate, manufacturing method of display apparatus and wiring substrate

Laser processing apparatus, laser processing method, manufacturing method of wiring substrate, manufacturing method of display apparatus and wiring substrate

机译:激光加工装置,激光加工方法,配线基板的制造方法,显示装置及配线基板的制造方法

摘要

A laser processing apparatus includes a support table, a local exhaust device, and a laser light source unit. The support table supports a processing object. The local exhaust device directs laser light into a local exhaust unit in which pressure is locally adjusted over the support table. The laser light source unit outputs the laser light. The local exhaust device is capable of relatively being lifted from the support table by injecting a lift gas to the support table. The processing object includes a multilayer film formed of two or more layers with different materials. An input unit into which reflectance of the processing object is inputted is connected to the laser light source unit.
机译:激光加工设备包括支撑台,局部排气装置和激光光源单元。支持表支持处理对象。局部排气装置将激光引导到局部排气单元中,在该局部排气单元中在支撑台上局部地调节压力。激光光源单元输出激光。局部排气装置能够通过向支撑台注入提升气体而相对地从支撑台提升。处理对象包括由具有不同材料的两层或多层形成的多层膜。激光光源单元连接有输入处理单元的反射率的输入单元。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号