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Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
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机译:电镀液,使用该溶液的多层印刷电路板的制造方法以及多层印刷电路板
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摘要
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.
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