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Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

机译:包括功率器件的半导体器件,该功率器件具有横向间隔开的第一金属层和第二金属层

摘要

A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.
机译:半导体器件具有由第一金属制成的第一金属层,该第一金属层具有至少一个连续的子部分。由第二金属制成的至少一个第二金属层放置在第一金属层的连续子部分上。第二金属比第一金属硬。第二金属层被构造为形成至少两个层区域,其设置在第一金属层的连续子部分上。第二金属具有含硼或含磷的金属或含硼或含磷的金属合金。

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