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Low-energy method for fabrication of large-area sputtering targets

机译:低能量方法制造大面积溅射靶

摘要

In various embodiments, large-area sputtering targets are formed by providing a plurality of sputtering targets each comprising a backing plate and a refractory metal layer disposed thereon, and spray depositing a refractory metal powder on an interface between the sputtering targets, the refractory metal powder consisting essentially of the same metal as each refractory metal layer, thereby joining the refractory metal layers of the sputtering targets.
机译:在各种实施例中,通过提供各自包括背板和设置在其上的难熔金属层的多个溅射靶,并在溅射靶与难熔金属粉末之间的界面上喷涂沉积难熔金属粉末,来形成大面积溅射靶。基本上由与每个难熔金属层相同的金属组成,从而连接溅射靶的难熔金属层。

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