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Low-energy method for fabrication of large-area sputtering targets
Low-energy method for fabrication of large-area sputtering targets
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机译:低能量方法制造大面积溅射靶
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摘要
In various embodiments, large-area sputtering targets are formed by providing a plurality of sputtering targets each comprising a backing plate and a refractory metal layer disposed thereon, and spray depositing a refractory metal powder on an interface between the sputtering targets, the refractory metal powder consisting essentially of the same metal as each refractory metal layer, thereby joining the refractory metal layers of the sputtering targets.
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