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Stress-distribution detecting semiconductor package group and detection method of stress distribution in semiconductor package using the same
Stress-distribution detecting semiconductor package group and detection method of stress distribution in semiconductor package using the same
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机译:应力分布检测半导体封装组以及使用该组的半导体封装中应力分布的检测方法
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摘要
A stress-distribution detecting semiconductor package group includes multiple stress-distribution detecting semiconductor packages each formed by resin-encapsulating a stress detecting semiconductor chip of the same size using an identical resin encapsulation structure. Each stress detecting semiconductor chip includes a piezoelectric element for stress detection and at least two electrode pads electrically connected to the piezoelectric element to measure an electrical property of the piezoelectric element. The piezoelectric elements of the stress detecting semiconductor chips are respectively disposed on the corresponding stress detecting semiconductor chips to be located at different positions from one another.
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