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Light-emitting-diode chip comprising a sequence of GAN-based epitaxial layers which emit radiation and a method for producing the same

机译:包括一系列发射辐射的基于gan的外延层的发光二极管芯片及其制造方法

摘要

A light-emitting diode chip (1) comprises a GaN-based, radiation-emitting epitaxial layer sequence (3), an active region (19), an n-doped layer (4) and a p-doped layer (5). The p-doped layer (5) is provided, on its main surface (9) facing away from the active region (19), with a reflective contact metallization (6) comprising a radioparent contact layer (15) and a reflective layer (16). Methods for fabricating LED chips of this type by thin-film technology are provided, as are LED components containing such LED chips.
机译:发光二极管芯片( 1 )包括基于GaN的发射辐射的外延层序列( 3 ),有源区( 19 >),n掺杂层( 4 )和p掺杂层( 5 )。 p掺杂层( 5 )在其背向有源区( 19 )的主表面( 9 )上具有反射触点金属化层( 6 ),包括辐射透性接触层( 15 )和反射层( 16 )。提供了通过薄膜技术制造这种类型的LED芯片的方法,以及包含这种LED芯片的LED组件。

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