首页> 外国专利> Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations

Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations

机译:具有穿孔体的薄膜体声谐振器,降低了对过程引起的横向尺寸变化的敏感性

摘要

Micro-electromechanical acoustic resonators include a resonator body suspended over a substrate. The resonator body may have a single perforation therein, which may extend substantially or completely therethrough. The resonator body may also be configured to have a center-of-mass within an interior of the perforation and/or a nodal line that overlaps the perforation. A perimeter and depth of the single perforation can be configured to reduce a susceptibility of the acoustic resonator to process-induced variations in resonant frequency relative to an otherwise equivalent resonator that omits the single perforation. In other embodiments, the resonator body may have multiple perforations therein that extend along a nodal line of the resonator.
机译:微机电声谐振器包括悬挂在基板上的谐振器主体。谐振器主体中可以具有单个穿孔,该穿孔可以基本上或完全延伸穿过其中。谐振器主体还可以被配置为在穿孔内部和/或与穿孔重叠的节点线内具有质心。可以配置单个穿孔的周长和深度,以相对于省略单个穿孔的等效等效谐振器,降低声谐振器对谐振频率的过程感应变化的敏感性。在其他实施例中,谐振器主体中可具有沿着谐振器的节点线延伸的多个穿孔。

著录项

  • 公开/公告号US7939990B2

    专利类型

  • 公开/公告日2011-05-10

    原文格式PDF

  • 申请/专利权人 YE WANG;HARMEET BHUGRA;

    申请/专利号US20090393566

  • 发明设计人 YE WANG;HARMEET BHUGRA;

    申请日2009-02-26

  • 分类号H01L41/09;

  • 国家 US

  • 入库时间 2022-08-21 18:08:01

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