METHOD OF FORMING ULTRAFINE-GRAIN-COPPER-BASE SPUTTER TARGETS

摘要

The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 &mgr;m for improving sputter uniformity and reducing sputter target arcing.