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thermally enhanced package for microcircuits and method for their production
thermally enhanced package for microcircuits and method for their production
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机译:用于微电路的热增强封装及其制造方法
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摘要
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.
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